Low-energy Measurement of the 86Kr(α, n)89Sr Reaction Cross Section and Its Impact on Weak R-process Nucleosynthesis
The Astrophysical Journal—peer-reviewed, Scopus/SCI
Dr. Manoj Kumar Pal
Assistant Professor•Department of Mechanical & Automobile Engineering
9 Yrs
Teaching Experience
12 Yrs
Total Experience
Ph.D.
Highest Qualification
6+
Published Works
About & Biography
Dr. Manoj Kumar Pal is an associate professor, specializing in alloy development, microstructural characterization, and failure analysis. He holds a Ph.D. in Materials Science and Technology from the University of Miskolc, Hungary, and has research experience at the Wigner Research Centre for Physics, Budapest, alongside extensive R&D work experience in Europe. His expertise includes SEM/EDS, EBSD, XRD, ICP-OES, and mechanical testing, with a focus on structure–property relationships in metallic and ceramic materials. As an educator, he emphasizes active learning, mentorship, and research-driven teaching, preparing students to excel in academia and industry.
Education & Qualifications
PostDoc2025
Post-Doctoral Fellow (PDF)
Nuclear Materials Science
HUN-REN Wigner Research Center for Physics, Budapest, Hungary
Doctorate2021
Ph.D.
Materials Science & Technology
University of Miskolc, Hungary
Masters2008
M.E.
Quality Engineering & Management
Birla Institute of Technology, Mesra, Ranchi
Bachelors2006
B.Tech
Industrial & Production Engineering
Uttar Pradesh Technical University Lucknow, U.P
Research Specialization & Focus Areas
- Material characterization
- Materials synthesis
- surface treatment
- Microstructural analysis
- SEM/EDS
- TEM
Scholarly Publications
6 publications
2025
2023
Growth Kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition
Journal of Materials Research and Technology—peer-reviewed, Scopus/SCI
Morphological and mechanical evolution of α-Al2O3 reinforced Mo-Cu alloy obtained by planetary ball milling
Journal of Manufacturing Processes—peer-reviewed, Scopus/SCI
Nucleation and location of Kirkendall voids at the Tin-based solder/copper joint: a review
Advanced Engineering Materials—peer-reviewed, Scopus/SCI
2020
Characterization of the interface between ceramics reinforcement and lead-free solder matrix
Surfaces and Interfaces—peer-reviewed, Scopus/SCI
2019
Investigation of microstructure and wetting behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with additions of 1.0 wt.% SiC on copper substrate
Intermetallics—peer-reviewed, Scopus/SCI
Honors, Awards & Recognitions
Stipendium Hungaricum Scholarship
2016Tempus Public Foundation, Hungarian government
Chang Sung Best Presentation Award
2018Republic of Korea